The first smartphones with the Snapdragon 865 on board have just arrived on the market, but we are already talking about the future top-of-the-range processor from Qualcomm. According to what was leaked in the past and reported by 91mobiles, the Snapdragon 875 should be able to count on a 5nm production process developed by the Taiwanese TSMC. This step should guarantee an interesting increase in terms of performance and a reduction in consumption.
The Snapdragon 875 should then be smaller than the current one thanks - probably - to the choice of integrate the new Snapdragon X60 5G RF modem directly into the SoC. A choice already adopted on the Snapdragon 765 mid-range chip. The CPU component could be Kyro 685, presumably with 8-core architecture, assisted by the Adreno 660 GPU and the Adreno 665 VPU.
The chip would complete the picture Spectra 580 for image processing, as well as support for LPDDR5 memory. In addition, rumors speak of the presence of the Qualcomm Secure Processing SPU250 unit. While the features appear to be fairly consistent for the Snapdragon 865 successor, remember that these are indiscretions that do not enjoy official status.
Qualcomm's Snapdragon 875 is expected to be announced in December. It will power the top-of-the-range smartphones of the first part of 2021 branded Xiaomi, OPPO, OnePlus and others. In the meantime, we're still waiting to figure out if the San Diego manufacturer still has plans to launch an enhanced version of the current Snapdragon 865.
The new Mi 10 with Snapdragon 865 is available for purchase on Amazon, via.